0.15mm Thickness 2 Layers IC Package Substrate For memory package

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0.15mm Thickness 2 Layers IC Package Substrate For memory package

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0.15mm Thickness 2 Layers IC Package Substrate For memory package

Memory Card PCB Produce by MEIKI Vacuum Laminator Direct use for Capsulation Application:Memory card,Micro SD card,Micro TF card,UDP card,USB,Chip substrate ,IC assembly substrate;Semiconductor,IC ...

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0.15mm Thickness IC Package Substrate

2 Layers IC Package Substrate

FR4 Substrate Printed Circuit Board

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