4L build up types 0.8mm Gold Surface IC Package Substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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City: Shenzhen

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4L build up types 0.8mm Gold Surface IC Package Substrate

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4L build up types 0.8mm Gold Surface IC Package Substrate

Application:Dram memory electronics,IC card,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics...

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Horexs IC Package Substrate 0.8mm

Gold Surface Multilayer Pcb Board

0.8mm IC Package Substrate

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